SK Hynix's Critical Battle! Report: HBM4 final samples are about to be delivered, and mass production could begin this month if NVIDIA certification is approved.

SK Hynix Reaches a Critical Turning Point in the HBM Market

On March 10, CitriNi7 analyst Jukan posted on X platform that, according to semiconductor industry sources, the company will soon submit the final samples of sixth-generation high-bandwidth memory (HBM4) to NVIDIA. If it passes NVIDIA’s qualification testing, it could receive mass production purchase orders as early as this month.

These samples are the result of multiple design revisions by SK Hynix since Q4 last year, aiming to meet NVIDIA’s maximum data transfer rate of 11.7 Gb/s.

The background of this certification test is particularly delicate. Samsung Electronics announced in February that it had supplied some HBM4 finished products to NVIDIA and claimed that they had started mass production and shipment without any redesign, gaining an early lead in the commercialization of HBM4. If SK Hynix fails to pass this certification, Samsung’s position as the “main supplier of HBM4” could be challenged.

The Final Push After Multiple Optimizations

The HBM4 final samples submitted by SK Hynix to NVIDIA have undergone several rounds of optimization and iteration.

According to industry sources, since the certification testing began in late October last year, both parties discovered compatibility issues between specific circuits of the Rubin GPU and HBM4. SK Hynix enhanced circuit characteristics and reduced the inter-layer spacing of stacked chips to improve speed, while NVIDIA provided assistance on multiple levels. The issues have now been resolved.

HBM4 is the core memory component of NVIDIA’s new AI accelerator, Rubin, which is expected to be released in the second half of this year. As SK Hynix’s flagship product for 2025, HBM4 stacks multiple layers of DRAM chips vertically, significantly surpassing traditional DRAM in capacity and data transfer speed.

The certification’s focus is not only on “pass or fail” but also on product grading. NVIDIA divides HBM products into Bin 1 (high-end) and Bin 2 performance tiers. SK Hynix faces the challenge of demonstrating technological strength in the final samples and increasing the proportion of high-end Bin 1 products in supply.

Samsung’s Early Lead, SK Hynix Under Pressure

Over the past few years, SK Hynix has held over 90% of the AI accelerator HBM market share, firmly establishing itself as NVIDIA’s core supplier through deep integration. However, as HBM4 enters commercialization, this dominance is being challenged.

Samsung announced in February that it had begun mass shipments of HBM4 to NVIDIA, emphasizing that it had completed mass production without redesign, which is seen as a significant breakthrough in HBM competition. In contrast, SK Hynix’s certification process has been delayed due to compatibility issues, putting its main supply position at risk.

Industry insiders suggest that whether the final samples can successfully pass certification will directly determine if SK Hynix can maintain its core position in NVIDIA’s supply chain. If certification is blocked, Samsung could solidify its role as the primary HBM4 supplier, reversing the current market landscape in AI memory.

High-Level Diplomacy, Chairman’s Personal Visit to GTC

At this critical stage of technological advancement, SK Group Chairman Chey Tae-won will personally lead efforts to promote HBM4 sales. According to sources, Chey Tae-won will attend NVIDIA GTC 2026 in Silicon Valley on March 16, where he is expected to meet with NVIDIA CEO Jensen Huang again and provide a special report on SK Hynix’s HBM technology capabilities.

Last month, Chey Tae-won already had a “fried chicken and beer” dinner with Huang in Silicon Valley, further strengthening their partnership. This GTC trip is seen as a high-level diplomatic move at a key certification milestone, aiming to support the landing of mass production orders from a business relationship perspective.

1c Process LPDDR6 Chip Development Achieves Breakthrough

Beyond the HBM4 challenge, SK Hynix announced today that it has successfully developed a 16GB LPDDR6 mobile chip based on the 10-nanometer sixth-generation (1c) process, the company’s most advanced DRAM process node to date.

According to SK Hynix, compared to the previous generation, the new product offers over 33% faster data processing speeds and over 20% better energy efficiency. The company plans to complete mass production preparations in the first half of this year and begin supply in the second half. The launch of 1c process LPDDR6 demonstrates SK Hynix’s ongoing advancement in advanced DRAM technology, providing new support for its competitiveness in the mobile memory market.

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